Solder joint reliability
US6246011A · kind A · utility
14Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1998 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Dec 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit arrangement comprising a circuit board and an electrical component attached thereto by a plurality of solder joints. The sizes of the joints are chosen according to a characteristic (for example the frequency) of signals to be conducted through them. The joint sizes are inversely proportional to the frequency of signals which they are arranged to conduct. The expected fatigue life of the arrangement is greater than one in which all joints are of a smaller size, as required for example for high frequency signals, and this reduces the need for component underfill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.