Semiconductor device and resin film
US6246114A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1997 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Oct 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180.degree. toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith incl…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.