Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6246582A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1998 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Dec 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/76
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit card module having increased cooling efficiency which comprises at least one printed wiring board (PWB), at least one component mounted on the PWB, a heatsink, an interchangeable frame, and a wedgelock for use with a chassis cold wall. One embodiment of the interchangeable frame comprises a protrusion so that it can be used with a convection-cooled chassis (fully compliant with IEEE 1101.2 Specifications). Another embodiment, for use with conduction-cooled chassis only (partially compliant with IEEE 1101.2 Specifications), is maximally efficient in removing heat as it does not include the protrusion. In the embodiment without the protrusion, the conduction contact area between the chassis cold wall and the frame is increased in width from approximately 0.25" to approximately 0.35". In either embodiment, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall. In addition, the wedgelock can be enlarged to increase the clamping force over the contact area. The increased wedgelock size approximately doubles the clamping force applied. The net effect of the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.