Patent · US Expired

Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts

US6246586A · kind A · utility

1Cited by
4References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 10, 1999
Grant dateJun 12, 2001
Priority date
Expiry dateSep 10, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K3/146
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

In a method wherein, before forming a thin film of, for example, metal on a supporting base in a vacuum, a vapor stream of patterning material for forming a pattern in the thin film is applied from nozzle holes, and the thin film is formed after this liquid has been adhered onto the supporting base, the patterning material is applied from the nozzle holes in such manner that it unifies on the supporting base. Thus, even when the pattern width is enlarged, a pattern can be formed in which the blurring at the pattern edges is small.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.