Anvil pad configuration for laser cleaving
US6247625A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 1998 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | May 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/386
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An improved anvil tool for use in laser bar or wafer cleaving comprises a relatively small cross section such that the anvil does not overhang the device edges in any direction. In one embodiment, the surface of the tool contacting the laser wafer or bar is compliant and contains a laterally disposed slit that aligns with the scribe mark on the top surface of the material to be cleaved. The anvil may be formed as a columnar tool or as a film deposited on a substrate. The compliant surface may be removable and in a preferred embodiment may comprise a continuous feed membrane tape so that a "clean" surface is used for each subsequent cleave operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.