Apparatus and method for uniformly melting the solder attaching a surface mount device to a printed circuit board
US6247630A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1997 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Dec 17, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flow control nozzle for hot gases includes an input end to receive a hot gas. An output end of the flow control nozzle delivers the hot gas to a surface mount device attached with solder to a printed circuit board. A gas distribution mechanism is positioned between the input end and the output end. A gas flow control mechanism is positioned in the gas distribution mechanism to selectively alter the flow of the hot gas through the gas distribution mechanism such that the gas distribution mechanism and the gas flow control mechanism operate to deliver the hot gas to the output end in a substantially uniform manner that facilitates substantially uniform melting of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.