Method of wafer temperature measurement
US6247842A · kind A · utility
3Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Jun 15, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for determining the temperature of a wafer during processing is disclosed. A test wafer is specially prepared in conjunction with a calibration chart. The difference in stack sheet resistance of the test wafer before and after processing is plotted onto the calibration chart to determine the temperature of the test wafer during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.