Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board
US6248428A · kind A · utility
45Cited by
12References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 .mu.m, and comprised of rough particles and fine particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.