Dendritic material sacrificial layer micro-scale gap formation method

US6248668A · kind A · utility

Assignee

• The Board of Trustees of the University of Illinois · US

Inventors

• David J. Beebe · Monona, US
• Hyuk-Jeen Suh · Cambridge, US
• Jeffrey S. Moore · Savoy, US
• Pamidighantam Bharathi · Champaign, US

Key dates

• Filing date: Jan 14, 2000
• Grant date: Jun 19, 2001
• Expiry date: Jan 14, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0108
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micro-scale gap fabrication process using a dry releasable dendritic material sacrificial layer. The fabrication process produces micro-scale gaps, such as those required between a suspended microstructure and an opposing surface in MEMS. The dendritic sacrificial layer is releasable by heating the dendritic material past its decomposition point after forming the microstructure. The sacrificial layer may be applied to a wafer, for example, by spin coating a solution including the dissolved dendritic material. The sacrificial layer, after being formed, may be patterned and prepared for accepting structural material for the microstructure. After a desired microstructure or microstructures are formed around the sacrificial layer, the layer is dry releasable by heating.