Method and apparatus for mounting a component and heat sink
US6249428A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Jan 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1431
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is described for mounting a component in a computer chassis. The present embodiment includes an embodiment in which the component is associated with a heat sink. A mounting bracket, including at least one slot, is disposed on a component. At least one fastener affixes the mounting bracket and component to the chassis. In an alternative embodiment, the component can be secured to an interposer plate affixed to the chassis. The plate includes threaded openings for engaging the fasteners. A second supporting means engages the mounting bracket also. In the present embodiment, the second supporting means is a cover including at least one tab. When the cover is coupled with the chassis, the tabs align with and engage the slots of the mounting bracket. A guide is described for aligning an electrical connector of the component with a corresponding connector of the computer, wherein the connectors make the electrical connection as the component is secured to the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.