Heat sink with offset fin profile
US6249437A · kind A · utility
2Cited by
12References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a heat sink that, in a particularly advantageous embodiment, includes a heat sink body with a spine configured to be oriented parallel with the direction of air flow when the heat sink is coupled to a substrate. The heat sink further includes a first set of cooling fins that are coupled to and extend from the spine along a first common longitudinal axis. At least two of the first set of cooling fins laterally extend from the first common longitudinal axis in a common direction and in an offset relationship to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.