Millimeter wave multilayer assembly
US6249439A · kind A · utility
75Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1999 |
| Grant date | Jun 19, 2001 |
| Priority date | — |
| Expiry date | Oct 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.