Heat-dissipating aluminum silicon carbide composite manufacturing method

US6250127A · kind A · utility

Assignee

• Polese Company, Inc. · US

Inventors

• Frank J. Polese · San Diego, US
• Jack Rubin · San Diego, US
• Michael J. Singer · San Marcos, US
• Walter V. Chichra · Beacon, US
• Anthony P. Grodio · Lagrangeville, US
• Vlad Ocher · San Diego, US
• Henry Escalante · San Diego, US
• William F. Dixon · Tucson, US
• David L. Rose · Boston, US
• Stuart Weinshanker · San Diego, US

Key dates

• Filing date: Oct 11, 1999
• Grant date: Jun 26, 2001
• Expiry date: Oct 11, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S72/70
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as "Al--SiC" or "AlSiC"). The process involves selecting a mass produced quantity of Al--SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al--SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.