Device and process for shaping workpieces with laser diode radiation
US6251328A · kind A · utility
28Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1998 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Jul 8, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/0734
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multiplicity of laser diodes aim laser light directly onto the surface of a workpiece and are disposed over and according to the to-be-shaped contour of a workpiece, so that a detector unit for determining the spatial shaping of the workpiece and an evaluation and control unit can determine process parameters for further illumination in dependence on a comparison of an actual state of shaping and a desired state of shaping of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.