Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects
US6251557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Sep 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a photosensitive resin composition for rapid prototyping comprising: PA1 a. about 30 wt. % to about 70 wt. % of at least two epoxy resins, at least one of these resins is solid at room temperature and comprises aromatic groups, and at least one of these resins is liquid, having a viscosity at 25.degree. C. lower than about 1,000 Pa.s, PA1 b. about 15 wt. % to about 50 wt. % of at least one multifunctional acrylate compound PA1 c. about 5 wt. % to about 30 wt. % of a hydroxyfunctional compound PA1 d. about 1 wt. % to about 6 wt. % cationic photoinitiator PA1 e. about 1 wt. % to about 6 wt. % free radical photoinitiator. The invention further relates to a process for the manufacturing of 3-dimensional objects, known as rapid prototyping, wherein the photosensitive resin composition is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.