Manufacturing metal dip solder bumps for semiconductor devices
US6251765A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Jul 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3468
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for forming solder bumps on a surface of a semiconductor device, such as a spherical-shaped semiconductor integrated circuit, is disclosed. Multiple devices are first aligned so that a vacuum chuck can hold all of the devices with an appropriate orientation. The vacuum chuck can then dip the devices into different molten metal compounds to form a plurality of solder bumps. Metal solder materials of different melting points are chosen so that the thickness of the solder bumps are partially controlled by the number of layers of solder metal sequentially grow on the metal pads. Once the solder bumps are grown on the devices, the vacuum chuck can immediately transfer the devices to a tape and reel assembly for further transportation thereof. It can also be easily fed into a tube assembly which protects the spherical shaped semiconductor device with the solder bumps during the shipping process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.