Optical semiconductor device and optical semiconductor module equipped with the same
US6252252A · kind A · utility
24Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Apr 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mold 25 for molding semiconductor chips 23 and 24 serving as a light emitting element and a light receiving element, respectively, is made of a material capable of transmitting light. A groove 27 is formed on the region where light is emitted from and incident on the semiconductor chips so that it constitutes a reflecting face. Thus, the light is emitted and incident through the side E of the mold. In this configuration, the outer size of the light receiving element or light emitting element can be minimized, and the module provided with these semiconductor chips can also be miniaturized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.