Modifiable semiconductor circuit element
US6252291A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1998 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Sep 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip having a substrate with several overlaying metal layers. A lower metal layer is adjacent the substrate and an upper layer is spaced above the lower layer. The chip has circuitry including a number of circuit elements, and a number of access elements, each associated with and electrically connected to one of the circuit elements. Each access element includes first and second terminals in the lower layer, and an elongated span element in the upper layer. The span element has a first end overlaying and electrically connected to the first terminal and a second end overlaying and electrically connected to the second terminal. One of the terminals may be connected to provide power or a connection to the input or output of the associated circuit element. The chip may then be modified by severing the span element, or by connecting the span element to other circuitry on the chip to disable or enable operation of the circuit element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.