Chip type electronic part and method for the manufacture thereof
US6252481A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Nov 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/0013
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Delamination in the conventional chip-type electronic part may create voids thereinside, allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode, in such a way that fatigue may accumulate in the internal electrode, which eventually will results in the internal electrode being electrically disconnected. To solve this problem, a chip-type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode, wherein external electrodes of the chip-type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste. The former is achieved by impregnating the synthetic resins before the formation of the external electrodes and the later, by extending the pores from surfaces of the external electrodes to surfaces of a main body and then by impregnating the synthetic resins thereinto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.