IC card and its frame
US6252777A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1999 |
| Grant date | Jun 26, 2001 |
| Priority date | — |
| Expiry date | Oct 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching. The plane coil 10 in which a conductor line 11 is wound a plurality of times in substantially the same plane is formed by punching, terminals 10a, 10b of the plane coil 10 and electrode terminals 12a, 12b of the semiconductor element 12 are electrically connected to each other, the plane coil 10 is provided with an outside terminal 10a formed outside the coil and an inside terminal formed inside the coil, the semiconductor element 12 is arranged in such a manner that a forming face on which the electrode terminals 12a, 12b are formed or a plane reverse to the forming face is opposed to the conductor line 11 of the plane coil 10, the electrode terminals 12a, 12b of the semiconductor element 12 are respectively located adjacent to the outside terminal 10a and the inside terminal 10b of the plane coil 10, and the electrode terminals 12a, 12b are electrically connected to the terminals 10a, 10b of the plane coil 10 located on the same side with respect to the inside and outside of the coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.