Fabrication of high density multilayer interconnect printed circuit boards
US6255039A · kind A · utility
25Cited by
11References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1998 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Apr 3, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/23986
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.