Low-melting copolyester and copolyetherester hot-melt adhesives
US6255443A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G63/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel, quick-crystallizing hot-melt adhesive masses having a melting point between 60.degree. and 100.degree. C. comprise a statistically-proportioned copolyester or copolyetherester based on terephthalic acid, adipic acid and a mixture of aliphatic diols; the molar proportion of terephthalic acid is between 55 and 85 mole %, relative to the total acid quantity; and the molar proportion of adipic acid is between 15 and 40 mole %. A combination of butane diol and hexane diol is used as the diol component; the molar component of butane diol is between 40 and 55 mole %; and the molar proportion of hexane diol is between 40 and 60 mole %. Up to 15 mole % of a dimer acid having a molar mass between 400 and 800 g/mole, or up to 10 mole % of a higher-molecular polyethylene glycol having a molecular mass of 600 to 4000 g/mole, can be used to increase the flexibility. The copolyester or copolyetherester hot-melt adhesive masses of the invention can be used in the hot-melt method, and in powder-form coating methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.