IC card and plane coil for IC card
US6255725A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Thickness of an IC card is decreased, and the manufacturing efficiency of the IC card is enhanced so as to reduce the manufacturing cost. The IC card comprises: a semiconductor element 14 having electrodes; a plane coil 12 formed in such a manner that a conductor 12b is wound on the same face, having terminals 12a at respective ends; bonding wires 16 for electrically connecting terminals at both ends of the plane coil to the electrodes of the semiconductor element; and resin films 10 for sealing the semiconductor element, plane coil and bonding wires 16 when they are interposed between the resin films, wherein the thickness of the semiconductor element 14 is smaller than the thickness of the plane coil 12 and does not interfere with the conductor of the plane coil, and a thin wall thickness portion 12c is formed on a front face of the conductor of the plane coil through which the bonding wires can pass without protruding from the region of the thickness of the plane coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.