High temperature RFID tag
US6255949A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1999 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Sep 1, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/14852
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A high temperature RFID tag is described which has a survival temperature in the range of approximately -40.degree. C. to 300.degree. C. and an operating temperature in the range of approximately -20.degree. C. to 200.degree. C. In one embodiment of the invention, the RFID tag comprises a housing comprising a substantially flexible first thermally resistant material and having a base and a top, and a circuit board substrate comprising a substantially flexible second thermally resistant material which is encapsulated within the housing. In an additional embodiment of the invention, the high temperature RFID tag comprises a substrate assembly, the substrate assembly including a substrate having an integrated circuit disposed thereon, the substrate comprising a substantially flexible first thermally resistant material, and a high temperature encapsulant disposed on a first side of the substrate, the substrate assembly having a survival temperature in the range of -40.degree. C. to 300.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.