Jet solder feeding device and soldering method
US6257482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2000 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | May 23, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A jet solder feeding device allowing the molten solder ejected from ejecting ports to be kept at a desired height in a stable manner. The molten solder is ejected and fed from multiple ejecting ports formed on a corrugated plate, each wall portion surrounding the multiple ejecting ports formed on the corrugated plate is projected upward by coining or extrusion. This configuration allows the molten solder introduced under the corrugated plate to be satisfactorily guided by the conically shaped wall portion which surrounds each ejecting port and projected upward. Thus the molten solder ejected from the ejecting ports can be kept at a desired height, and in addition, its state is satisfactorily maintained in a stable manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.