Composition for stripping solder and tin from printed circuit boards
US6258294A · kind A · utility
8Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1997 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/067
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between printed circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.