Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions
US6258899A · kind A · utility
3Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1999 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | Apr 7, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/42
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent or and an amine promoter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.