Apparatus for separating non-metallic substrates
US6259058A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 1999 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | Jan 29, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0052
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for physically separating non-metallic substrates by forming a microcrack in the substrate and controlling propagating the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack in the substrate between its top and bottom surf. A scribe beam is applied onto the substrate on a separation line. A helium coolant stream intersets with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate. A preheat beam preheats the heat affected area on the substrate. The beams are formed by an arrangement of lases and mirrors and lenses. A movable mirror selectively diverts a beam to form either the preheat beam or one or more of the break and scribe beams.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.