Apparatus for coupling a test head and probe card in a wafer testing system
US6259260A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1998 |
| Grant date | Jul 10, 2001 |
| Priority date | — |
| Expiry date | Jul 30, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for coupling a test head and probe card in a wafer testing system incorporates a number of features that contribute to low impedance and reduced cross-talk, making the coupling apparatus particularly advantageous for high-speed test applications. The coupling apparatus may include, for example, an array of discrete conductor conduits that contain individual conducting elements. The conduits can be insulated, if desired, to reduce leakage. Further, the conduits can be made from metal, and terminated in dielectric interface plates for improved impedance matching. Divider elements can be provided to physically and electrically isolate adjacent rows of conductor conduits. Also, adjacent conducting elements can be connected to carry ground and signal potentials in an alternating manner such that signal carrying elements in a common row are separated from one another by ground carrying elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.