Method for specifying accelerated thermal cycling tests for electronic solder joint durability
US6260998A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for testing an electronic module to evaluate solder joint failures caused by thermally induced stress includes determining a thermal shock endurance test profile that represents field temperature conditions, estimating time/cycles to failure of solder joints in the module using numerical simulation techniques, selecting a design life duration for the module, comparing the design life duration of the module with the estimated time/cycles to failure of the weakest solder joint in the module, determining between robust, marginal, and non-robust module designs based on the design life duration of the module and the estimated time/cycles to failure of the at least one solder joint in the module, and determining an accelerated thermal shock endurance test specification having a test duration for testing the electronic module upon determining a marginal module design. The test duration and sample size requirements of the accelerated thermal shock endurance test are determined as a function of the field temperature conditions, the design life target, and the product reliability target of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.