Sputtering process
US6261423A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2000 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Sep 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for coating substrates having sides of the substrate with unequal adhesion properties includes the steps of non-symmetrically coating the substrate by coating a first side under a first set of coating conditions and coating a second side under a second set of operating conditions wherein the operating conditions used to coat each side are varied so as to compensate for the unequal adhesion properties of the sides. Also, a method for substrate preparation comprising the steps of: providing an annealed thermoplastic substrate base layer having a first surface and a second surface; stabilizing the substrate base layer in an environment having a baseline temperature and relative humidity; drilling vias in the base layer; subjecting the first and second surfaces of the base layer to ion processing so as to remove contaminants caused by drilling the vias and to prepare the first and second surfaces for sputtering; metalizing the base layer by first sputtering at least one metal layer onto the first surface of the base layer and subsequently sputtering at least one metal layer onto the second surface of the base layer said sputtering of the metal layers being controlled so as to …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.