Electroplating machine
US6261425A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 8, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Nov 8, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.