Package for electronic device having a fully insulated dissipator
US6262480A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jul 20, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a package of plastic material for a semiconductor electronic device having heat sink fully embedded within the package plastic case, is of the type which provides for forming the plastic case within a mold on whose interior a heat sink has been placed which has a first major surface to be insulated by means of a plastic material layer with a first thickness, whereon a metal leadframe and at least one semiconductor material die having an electronic circuit formed thereon have been fixed, and a second major surface opposite from the first and to be insulated by means of a plastic material layer with a second thickness, thinner than said first thickness; and at least one supporting element adapted to be positioned inside the mold cavity facilitating properly spacing the second surface of the heat sink out from a facing wall of the mold cavity during the process of introducing the plastic material for molding. During package formation, a tapered tip of the at least one supporting element is disposed within a trench defined along the second surface of the heat sink so that the heat sink trench is substantially filled with plastic material when the plastic material i…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.