Semiconductor device
US6262482A · kind A · utility
105Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1998 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device 1 according to the present invention, a plurality of inner leads are bonded to a front surface of a semiconductor element 11 covered by a package 10, with bent portions 17 formed at some inner leads 13a among the plurality of inner leads 13 and the front ends of the bent portions 17 exposed at a front surface of the package 10. This structure ensures that the semiconductor element is not caused to move vertically inside the forming die by the pressure of the liquid resin or the like during the sealing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.