Thermally actuated microelectromechanical systems including thermal isolation structures
US6262512A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1999 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Nov 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2061/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Microelectromechanical structures include a microelectronic substrate and spaced apart supports on the microelectronic substrate. A beam extends between the spaced apart supports and expands upon application of heat thereto, to thereby cause displacement of the beam between the spaced apart supports. The application of heat to the beam creates a thermal conduction path from the beam through the spaced apart supports and into the substrate. A thermal isolation structure in the heat conduction path reduces thermal conduction from the beam, through the spaced apart supports and into the substrate, compared to absence of the thermal isolation structure. The thermal isolation structure preferably has lower thermal conductivity than the beam and the supports. The heat that remains in the beam thereby can be increased. The thermal isolation structure may include a thermally insulating structure at each end of the beam, a thermally insulating structure in each spaced apart support, a thermally insulating structure in the substrate adjacent each spaced apart support, and/or at least one thermally insulating structure in the beam. Accordingly, improved thermal efficiency for microelectromech…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.