Electronic component and method of production thereof
US6262513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1997 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Dec 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the electronic device can be simplified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.