Multi-layer printed wiring board having integrated broadside microwave coupled baluns
US6263198A · kind A · utility
15Cited by
9References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 14, 1996 |
| Grant date | Jul 17, 2001 |
| Priority date | — |
| Expiry date | Jun 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microwave broadside coupled balun integral in a multi-layer printed wiring board formed by broadside coupled conductors embedded in the multi-layer printed wiring board. The balun may be used to form components which are integrated into the multi-layer printed wiring board, such as a microwave mixer formed by two of said broadside coupled baluns embedded in a multi-layer printed wiring board and connected to a diode ring quad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.