Heat dissipating structure and its manufacturing method
US6263956A · kind A · utility
14Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2000 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Apr 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The heat dissipating structure mainly includes a heat dissipating base, one or several heat dissipating fins, and a fixing frame. It can improve the ratio of fin's height to width, to increase the effective heat transfer area, and to promote the cooling capacity, especially for electronic elements. About the manufacturing method, it includes three steps: machining, inserting and injecting. So, the manufacturing method is simple and the required machines are general.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.