Integrated active cooling device for board mounted electric components
US6263957A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2000 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Jan 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated cooling device for use in cooling an electronic component or an integrated circuit and a method of manufacturing the same. In one embodiment, the device includes: (1) a plate couplable to and supportable by the electronic component, the plate having at least one channel therein, (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat receiving portion, (3) a coolant located within the circulation pipe and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.