Patent · US Expired

Alloy foil for liquid-phase diffusion bonding bondable in oxidizing atmosphere

US6264761A · kind A · utility

10Cited by
6References
24Claims
0Family size

Inventors

Key dates

Filing dateJan 6, 1999
Grant dateJul 24, 2001
Priority date
Expiry dateJan 6, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12431
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

The present invention provides liquid phase diffusion bonding alloy foils capable of bonding in an oxidizing atmosphere, which can ensure joints with a homogeneous structure and adequate tensile strength in air in a short period of time using various alloys or Fe-based materials as materials to be bonded; specifically, they are Ni-based liquid phase diffusion bonding alloy foils with compositions comprising as essential components in terms of atomic percent, the diffusion elements B or P at 1.0-20.0% or B and P each at 1.0-20.0%, and Si at 0.5 to .ltoreq.15% or 0.5 to <10% and V at 0.1-20.0%, with the remainder substantially Ni and unavoidable impurities, and having a thickness of 3-100 .mu.m. If necessary, one or more types of Cr, Mn or Mo, Co, and/or one or more types of W, Nb and Ti may be selectively included as appropriate. Compositions with a substantially amorphous crystal structure are most effective.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.