Method and control system for applying solder flux to a printed circuit
US6265017A · kind A · utility
4Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1999 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Aug 16, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.