Radiation curable resin composition
US6265133A · kind A · utility
7Cited by
5References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 11, 1998 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Dec 11, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F290/062
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation curable resin composition comprising (A) a first linear (meth)acryloyl and aromatic group-containing compound, (B) a second branched (meth)acryloyl group-containing compound, (C) a radiation polymerization initiator, and (D) silica particles having a secondary average particle diameter of 0.5 to 5 .mu.m. The composition is suitable for use as a printable heat-resistant protective coat which is used for information recording media such as thermosensible recording cards and thermosensible photographic printing paper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.