Wire bonding surface and bonding method
US6265300A · kind A · utility
15Cited by
13References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1993 |
| Grant date | Jul 24, 2001 |
| Priority date | — |
| Expiry date | Nov 18, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.