Method and apparatus for handling laser bars
US6267282A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1999 |
| Grant date | Jul 31, 2001 |
| Priority date | — |
| Expiry date | Apr 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/18
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for cleaving a laser bar into semiconductor chips. The apparatus includes a supporting structure on which a member slides. The apparatus also includes a pair of film layers. The laser bar is positioned between the film layers. A chamber is sealed to the top film layer. The chamber has an inlet through which gas is input. The movement of the member and the downward force caused by the buildup of gas pressure in the chamber induce cleaving of the laser bar at predetermined locations. The laser bar may have score marks at the predetermined locations to produce weak points. Pressure pulses may be coordinated with the movement of the member to break the laser bar at the desired locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.