Fixed abrasive finishing element having aids finishing method
US6267644A · kind A · utility
40Cited by
62References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Jul 31, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of using a finishing element having a fixed abrasive finishing surface including boundary lubricants for finishing semiconductor wafers is described. The lubricants in the finishing element are transferred to operative finishing interface a forming lubricating boundary layer. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.