Resin sealed optical module
US6269209A · kind A · utility
15Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1998 |
| Grant date | Jul 31, 2001 |
| Priority date | — |
| Expiry date | Jul 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module including a substrate, an optical waveguide formed on the substrate, and an optical element mounted on the substrate so as to be optically coupled to an end of the optical waveguide, for performing conversion between light and electricity. The optical module further includes a transparent resin for covering at least an optical coupling portion between the optical waveguide and the optical element, and a thermoplastic resin for covering only the optical element and its periphery including the transparent resin to seal the optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.