Method of assembling a peripheral device printed circuit board package
US6269537A · kind A · utility
18Cited by
34References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1999 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Jul 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49988
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.