Cooling device with heat pipe
US6269866A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Apr 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a cooling device provided with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a the heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.