Semiconductor chip mounting method utilizing ultrasonic vibrations
US6269999A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Aug 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting method of the present invention utilizing ultrasonic vibrations involves the following steps: a semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a suction hole, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and ultrasonic vibrations are applied from the suction tool to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate in order to bond said conductive bumps with said connection wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.