Mounting for high frequency device packages
US6270357A · kind A · utility
Inventor
Key dates
| Filing date | Apr 10, 2000 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Apr 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05554
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Test and/or burn-in sockets for high frequency electronic device packages are formed using contact pins having parallel ends joined by a support beam supported so that one end of the pin extends through a guide into a cavity in the socket and the other end extends through a second guide displaced from the first guide. The outer ends of the contact pins are arranged to contact input/output lands of a external circuitry such as a burn-in board or the like and the inner ends arranged to contact input/output leads or lands on an electronic LGA package. The end portions of the contact pins are constrained in parallel guides which are arranged to precisely align the ends of the pins with the terminal lands and the length and size of the contact pins are minimized to minimize signal distortion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.